Issue link: https://iconnect007.uberflip.com/i/1473479
76 PCB007 MAGAZINE I JULY 2022 However, while these tech trends are driv- ing opportunities for the PCB fabricator, they also present significant challenges. When this author interviewed nine board fabricators, the following concerns were cited most: • Higher layer counts/more HDI/thicker boards • Finer lines and spacing—sub 2 mil L/S • Finer pitch • Ultra HDI • Small components and micro BGAs • Higher aspect ratios • Stacked blind vias and reliability issues • inner dielectrics • High-speed materials-processing • Copper via filling capability In addition, with profit margins already being squeezed by increases in the cost of raw materials and transportation, these firms will continue to have difficulty in attracting and retaining skilled workers. Workforce develop- ment and retention have been impediments to growth for years. What can be done? A Path Forward A change in mindset will be needed for most North American-based PCB fabricators to move into higher-end advanced technology and manufacturing. One cannot enhance qual- ity and jump up the technology curve without making strategic investments. ey will need to upgrade and develop the workforce, and not only engineers but also manufacturing person- nel who need to understand the critical aspects of workflow, quality, and time-to-delivery. ey will also need to increase manufacturing capac- ity. And yes, there is a cost to that. However, a loss of market share, excessive reliance on over- seas fabrication, and dwindling technological advances are the unacceptable alternatives. Currently, industry and government actors are planning investments of at least $50 bil- lion into state-of-the-art semiconductor chip making facilities in the United States. Even so, these facilities, when up and running, will pro- vide only a portion of U.S. chip needs. And this begs another question: Where will these chips go? Electronic systems require Figure 5: More than half of the OEMs surveyed make products for the IoT.