Issue link: https://iconnect007.uberflip.com/i/1473479
78 PCB007 MAGAZINE I JULY 2022 in-house be able to make this investment? One idea would be to subsidize the top 100 firms identified by key OEMs and mil-aero-qualified fabricators with tax incentives and low- to no- interest loans. Assuming the investments iden- tified in Table 1 are made by the 100 firms, the grand total is still just $1 billion—significantly less than the cost of a single $10 billion chip- making facility. Another possible strategy is for firms to apply for R&D tax credits and, if possible, take advantage of accelerated depreciation on the new investments. Policymakers would be wise to impose a few more requirements on firms that receive such funds and incentives, including paying their workers a livable wage and providing medi- cal and dental benefits; providing a safe work- ing environment; and increasing its workforce commensurate with the added investment. e near-term objective would be to dou- ble the manufacturing capacity for high-reli- ability complex printed circuit boards and IC substrates in the United States over the next three years, followed by another 50% increase in capacity by the year 2027. Summary While these capacity-expansion goals may seem overly optimistic, given the existing PCB interconnect fabrication footprint already existing in the United States, it is quite feasi- ble. e initiative would involve leveraging the existing, installed base to increase capacity and further advance its manufacturing technology. If the federal government as well as the major chip manufacturers are serious about semicon- ductor fabrication in the U.S., then they will need to drive significant investment in printed circuit board manufacturing and the work- force as well. PCB007 Mike Carano is chairman of the IPC Thought Leaders Program, and an I-Connect007 columnist. To read Mike's column, Trouble in Your Tank, click here. By Ken Schramko, IPC After more than two decades of outsourcing, the United States still designs cutting-edge electronics but manufactures only a small fraction of the global supply, creating serious risks to U.S. economic and national security. Now there is a pair of bills in the U.S. Congress that would directly address these concerns, and IPC is leading the charge for them. The Bipartisan Innovation Act—also known as the U.S. Innovation and Competition Act (USICA) in the Senate and the America COMPETES Act in the House—would provide $52 billion to boost U.S. semiconductor chip manufacturing and bil- lions more for research and development of other advanced technologies. Meanwhile, the bipartisan Supporting American Printed Circuit Boards Act (the PCB Act) is a new proposal to invest in the domestic electronics sup- ply chain by incentivizing purchases of domestically produced PCBs and investments in factories, equip- ment, workforce training, and R&D. In a new IPC video interview, IPC Vice Presi- dent of Global Government Relations Chris Mitch- ell explains why Congress must enact these bills as part of a holistic approach to rebuild the domes- tic electronics manufacturing ecosystem. He also urges IPC members to get involved and make their voices heard on this business-critical issue. To learn more and take action, visit IPC.org and look on the Advocacy page; then visit the Action Alert Cen- ter to send a message to your members of Congress with just a few clicks. You may also contact IPC's Ken Schramko if you'd like to add your company's name to our roster of support for these bills. Please use this easy link that will identify your U.S. representative and allow you to quickly send them a message of support. There are also options for posting on social media or making a quick phone call. (Source: IPC) The U.S. Economy Needs the Bipartisan Innovation Act and the PCB Act