Issue link: https://iconnect007.uberflip.com/i/1475604
IPC ADVANCED PACKAGING SYMPOSIUM: Building the IC-Substrate and Package Assembly Ecosystem EXPERIENCE AND LEARN: • 28 speakers, eight sessions, and three keynotes focus on strengthening the IC-Substrate and Package Assembly Ecosystem in North America and Europe • Identify key challenges to overcome to enable sustainable businesses over the long run • Focus on 'punching through' into actionable research, development, design, materials, manufacturing, and business operations execution needs • Actionable next steps and an expanded network for continued development efforts October 11-12, 2022 Kimpton Hotel Monaco Washington, D.C. ipc.org/event/advanced-packaging-symposium