IPC
ADVANCED
PACKAGING
SYMPOSIUM:
Building the IC-Substrate and
Package Assembly Ecosystem
EXPERIENCE
AND LEARN:
•
28 speakers, eight sessions, and three
keynotes focus on strengthening the IC-Substrate
and Package Assembly Ecosystem in North America and Europe
•
Identify key challenges to overcome to enable sustainable businesses
over the long run
•
Focus on 'punching through' into actionable research, development, design,
materials, manufacturing, and business operations execution needs
•
Actionable next steps and an expanded network for continued development efforts
October 11-12, 2022
Kimpton Hotel Monaco
Washington, D.C.
ipc.org/event/advanced-packaging-symposium
