PCB007 Magazine

PCB007-Aug2022

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74 PCB007 MAGAZINE I AUGUST 2022 Ink Preparation/Curing In addition to jetting the ink, the system may have to prepare the ink (by melting a hot-melt ink) or by curing a UV ink. System Software and Positioning e additional system activ- ities may include positioning of the inkjet heads and, par- ticularly, the preparation of the CAM information to drive the inkjet heads and substrate positioning. Table 1 illus- trates the printing time for a 75/75-micron traces on a 460 mm x 610 mm panel using only one head vs. 15 heads. Table 1: Input parameters for a 460 mm x 610 mm panel of 75/75-micron t/s using one head vs. 15 heads 3 . Figure 5: Test vehicle printed with the Dow LITHOJET 200-series etch resist inks using the Dimatix DMP materials printer with a 10-picoleter head 3 .

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