Design007 Magazine

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• Design007 Magazine — September 2022
• Feature Contents — Supply Chain Management
• Additional Contents
• Column — Working Through the Design Pain
• Feature Interview — A New Sourcing Paradigm
• Feature Q&A — Some Relief, But Hold Off on the Party
• Short — NASA Engineer Develops Tiny, High-Powered Laser to Find Water on the Moon
• Column — Utilizing a Field Solver for Stackup Planning
• MilAero007 Highlights
• Short — Tech Employment Increases as Companies Keep Up Pace of Hiring
• Feature Interview — Altium's EDDI Report Tracks Component Availability—Today and Historically
• PCB007 Highlights
• Column — Optimizing Co-design Across Multiple Domains
• Feature Article — Designing Through Supply Chain Pain
• Infographic — PCB Fabricators are Feeling the Squeeze
• Column — Success Begins With a Little Confidence
• Article — DFM 101: Final Finishes—ENEPIG and IAg
• Short — Four Large Agreements Prop Up 2022 Semiconductor M&A Total
• Column — Comparing Traditional and Bio-based Resins
• Flex007 Highlights
• Feature Article — The Chip Shortage Leads to Innovation
• Short — All Systems Go: Time Traveling to 2030 for ML-Augmented PCB Design
• Column — The Rapidly Expanding Realm of Stretchable Circuits
• Short — Print, Recycle, Repeat: Scientists Demonstrate a Biodegradable Printed Circuit
• Interview — The Printed Electronics Roundtable, Part 2
• Top Ten Editor's Picks
• Career Opportunities section
• Educational Resources
• Advertiser Index and Masthead
• Problems Solved! Subscribe to Our Magazines