Issue link: https://iconnect007.uberflip.com/i/1480758
32 SMT007 MAGAZINE I OCTOBER 2022 covers papers on substrates, PCB fabrication chemistries, adhesives, solders, and more." e Interconnect Reliability and Research (IRR) Symposium has outstanding content that will help attendees understand the mech- anisms that drive failure. e following track names have remained the same: • Advanced Packaging Technology: Includes new research completed since the very popular Wafer Level Packaging Symposium in the spring • Inspection and Test (INS): Highlights useful testing • Technical Innovations: Covers machine learning, digital factory, and unique processes ere were so many papers in the Manufac- turing Excellence (MFX) and Low Tempera- ture Solder (LTS) tracks that there are several sessions for each. "Papers in the MFX track cover challenges in key SMT process areas including stencils, sol- der paste application to PCBs, reflow solder- ing, and cleaning of soldered assemblies," Silk says. "Also included is a session on Smart fac- tory developments." ere is also a diverse cross-section of authors presenting the LTS track papers. ey include researchers at universities, engineers from solder manufacturers, semiconductor package suppliers, and OEMs supplying prod- ucts to the consumer, computer, and server markets. Topics run the gamut from thermal cycling of heterogeneous and homogeneous low temperature solder joints, manufacturabil- ity concerns including rework, and solder composition effects on solder joint micro- structure. Of particular interest to many are the papers on electromigration in SnBi sol- ders, since electromigration of low temper- ature solders has been raised recently as a major topic to study in detail. "You may have a difficult time selecting which of these excellent papers to attend," Silk says. "To help somewhat, the Techni- cal Conference has been arranged to avoid overlap of concurrent sessions in two of the largest tracks, IRR and LTS. ere is also a helpful schedule posted on the conference program website with the option to create an account online or download an app that allows you to choose the sessions you want to attend." For more in-depth training, there are seven industry experts instructing half-day Profes- sional Development Courses on electronics reliability and process-specific topics. On the aernoon of Oct. 31, you can choose from: • Cleaning and Cleanliness Testing • Defeating Defects in Electronics Assembly • Passive ermal Management • Reflow Profiling Simplified For the morning of Nov. 1, your options are: • Reliability Testing • Tolerance Mistaken • Low Temperature Solder Julie Silk