Issue link: https://iconnect007.uberflip.com/i/1480758
34 SMT007 MAGAZINE I OCTOBER 2022 "I recommend selecting the conference bun- dle when you register so you can make the most of your trip and get the best value to attend both the conference sessions and courses," Silk says. Overall, she's excited about S M TA In te r - n a t i o n a l a n d what it offers. "e very best thing about the conference is the discussions that flow from the presentations and the con- nections that spark from these discussions," Silk says. "Young professionals will benefit tremendously from these connections and the planned special activities for them. Please encourage their attendance." She's also looking forward to the forum on surface mounting onto printed electronics. is roundtable discussion will bring in indus- try experts and include all who are curious to come up with actionable insights on this emerging technology. "I'm also excited about the Women's Leader- ship Program, which has some great speakers talking about their careers and providing guid- ance," Silk says. "It will be followed by speed mentoring and a reception." More details and the complete technical pro- gram can be found here. SMT007 Dudi Amir, Intel Corporation Martin Anselm, Ph.D., Rochester Institute of Technology Babak Arfaei, Juniper Raiyo Aspandiar, Ph.D., Intel Corporation Nilesh Badwe, Ph.D., Indian Institute of Technology, Kanpur Jasbir Bath, Bath Consultancy Andy Behr, Panasonic Elizabeth Benedetto, HP Inc. Mike Bixenman, DBA, MBA, KYZEN Corporation Lars Boettcher, Fraunhofer IZM Berlin Robert Boguski, Datest Corporation Keith Bryant, KB Consultancy Kevin Bryd, Intel Corporation Bill Capen, Honeywell FM&T Bill Cardoso, Ph.D., Creative Electron, Inc. Burton Carpenter, NXP Semiconductors Srinivas Chada, Ph.D., Project Kuiper-Amazon Lenora Clark, MacDermid Alpha Electronics Solutions Jean-Paul Clech, EPSI, Inc. Marie Cole, IBM Corporation (retired) William Cooper, John Deere Electronics Solutions Inc. Eric Cotts, Binghamton University Richard Coyle, Nokia Bell Labs Priyanka Dobriyal, Ph.D., Intel Corporation Michael Ford, Aegis Software Trevor Galbraith, Global SMT & Packaging James Elliott Fowler, Sandia National Laboratories Jie Geng, Ph.D., Indium Corporation Faramarz Hadian, Nokia Bell Labs Sa'd Hamasha, Ph.D., Auburn University Carol Handwerker, Purdue University Md Hasnine, Ph.D., Qorvo, Inc. David Hillman, Collins Aerospace Jason Keeping, Celestica, Inc. Jeffrey Kennedy, ZESTRON Corporation Robert Kinyanjui, Ph.D., John Deere Electronics Solutions Inc. Richard Kraszewski, Plexus Corp. Pradeep Lall, Ph.D., Auburn University Dale Lee, Plexus Corp. Tanya Martin, SMTA Andrew Mawer, NXP Semiconductors James Morgan, Celestica, Inc. Tim Pearson, Collins Aerospace Scott Priore, Cisco Anto Raj, Medtronic Brian Roggeman, Qualcomm Technologies Inc. Chrys Shea, Shea Engineering Services Rajen Sidhu, AMD Julie Silk, Keysight Technologies Gregory Vance, Rockwell Automation Rebecca Wheeling, Ph.D., Sandia National Laboratories Charles Woychik, Ph.D., i3 Microsystems Inc. Committee Members