Design007 Magazine
Design007-Oct2022
Issue link:
https://iconnect007.uberflip.com/i/1481368
Contents of this Issue
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Articles in this issue
Design007 Magazine — October 2022
Feature Contents — To UHDI and Beyond!
Additional Contents
Column — Let's Get Small
Feature Interview — Ultra HDI Primer
Feature Article — A Designer's Point of View
Column — Routing Strategies to Minimize Radiation
Short — Discovery of New Nanowire Assembly Process Could Enable More Powerful Computer Chips
Feature Q&A — The Learning Curve for Ultra HDI
Column — The ABCs of Clean Schematics
Short — A World First: Self-calibrated Photonic IC: New Interchange for Optical Data Superhighways
MilAero007 Highlights
Feature Column — Ultra High Density Circuit Board Design
Column — Thermal Management Isn't Getting Easier
Column — Noise Mitigation in Power Planes
Short — At the Water's Edge: Self-assembling 2D Materials at a Liquid-Liquid Interface
PCB007 Highlights
Feature Column — Scaling PCB Design to the Power of 10
Column — Avoiding Conformal Coating Pitfalls
Column — Unblocking Innovation With a Component Digital Thread
Flex007 Highlights
Article — Market and Tech Converence: Electrically Conductive Inks
Short — Researchers Develop Novel Spectrum Sensing Technique for 6G-oriented Intelligent IoT Communications
Column — The Chameleon of Interconnection Technologies
Interview — The Printed Electronics Roundtable, Part 3
Top Ten Editor's Picks
Career Opportunities section
Educational Resources
Advertiser Index and Masthead
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