Design007 Magazine

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• Design007 Magazine — October 2022
• Feature Contents — To UHDI and Beyond!
• Additional Contents
• Column — Let's Get Small
• Feature Interview — Ultra HDI Primer
• Feature Article — A Designer's Point of View
• Column — Routing Strategies to Minimize Radiation
• Short — Discovery of New Nanowire Assembly Process Could Enable More Powerful Computer Chips
• Feature Q&A — The Learning Curve for Ultra HDI
• Column — The ABCs of Clean Schematics
• Short — A World First: Self-calibrated Photonic IC: New Interchange for Optical Data Superhighways
• MilAero007 Highlights
• Feature Column — Ultra High Density Circuit Board Design
• Column — Thermal Management Isn't Getting Easier
• Column — Noise Mitigation in Power Planes
• Short — At the Water's Edge: Self-assembling 2D Materials at a Liquid-Liquid Interface
• PCB007 Highlights
• Feature Column — Scaling PCB Design to the Power of 10
• Column — Avoiding Conformal Coating Pitfalls
• Column — Unblocking Innovation With a Component Digital Thread
• Flex007 Highlights
• Article — Market and Tech Converence: Electrically Conductive Inks
• Short — Researchers Develop Novel Spectrum Sensing Technique for 6G-oriented Intelligent IoT Communications
• Column — The Chameleon of Interconnection Technologies
• Interview — The Printed Electronics Roundtable, Part 3
• Top Ten Editor's Picks
• Career Opportunities section
• Educational Resources
• Advertiser Index and Masthead
• Problems Solved! Subscribe to Our Magazines