Issue link: https://iconnect007.uberflip.com/i/1481368
OCTOBER 2022 I DESIGN007 MAGAZINE 9 Columnist Vern Solberg discusses how to conduct an interconnect capacity analysis to determine whether a design should utilize HDI or UHDI features. Jan Pedersen of NCAB, co-chair of the IPC D-33-AP Subcommittee, details their efforts to form UHDI standards. Kelly Dack then describes how he suddenly found himself work ing on designs w ith 15-micron lines and offers some advice for working on these tiny features. We bring you columns from Barry Olney, Matt Stevenson, John Coonrod, Istvan Novak, Saskia Hogan, Matt Walsh, and Joe Fjelstad. In our flex space, we have an article by Stan Farnsworth and the concluding installment of our printed electronics roundtable with Kevin Miller, Mike Wagner, John Voultos, and Tom Bianchi. ere's a real need for information about UHDI. As you move forward into the world of microns, I hope you will consider this month's Design007 Magazine as a reference. One final note, if you haven't already, be sure to follow us on LinkedIn and Twitter. ere you'll find updates and links to many of our most popular features. Let's have a conversation online, and get small! DESIGN007 Andy Shaughnessy is managing editor of Design007 Magazine. He has been covering PCB design for 23 years. To read past columns, click here. Even as the use of UHDI continues to grow with processes such as A-SAP and mSAP, there's a dearth of information available in Eng- lish. Very few instructors in our industry teach UHDI design or fabrication curriculum, and there are not many UHDI resources online or elsewhere. We realized this was a great chance for Design007 Magazine to help fill that void by focusing on UHDI processes. So, we asked some of the top UHDI experts to share their knowledge about designing and fabricating these tiny features. In this issue, we cover the challenges and opportunities in UHDI design, and the level of commitment required to become one of these top-level designers. Our goal is that you understand the critical points in the UHDI fabrication process to advance your capabilities of UHDI design. In our conversation with Royal Circuits' UHDI expert Herb Snogren, he explains exactly what constitutes ultra HDI, where the current cutting edge lies, and the hurdles facing anyone who wants to design or manufacture boards at the 20-micron level or below. Instructor Cherie Litson breaks down the semi-additive manu- facturing process and shares some of her tips and tricks for designing A-SAP and mSAP cir- cuits. Columnist Tara Dunn explains how to speed up the "learning curve" for UHDI cir- cuits, and she answers common questions from new UHDI technologists.