OCTOBER 2022 I DESIGN007 MAGAZINE 95
We've seen many changes over the past few
years, and nowhere are they more evident
than in the world of sourcing
components. Sourcing has
become one of the
biggest challenges
facing PCB design-
ers and design
engineers
today.
In this month's
column, two of
Electrolube's
leading resin
specialists
have collabo-
rated to give you the clearest focus of how
introducing bio-based resins systems will
impact your production process and the
benefits they bring in terms of performance.
Regarding basic principles of thermal dis-
sipation there are three ways of dissipating
energy: Conduction, convection, and radia-
tion. The integrated metal substrate (IMS)
printed circuit boards rely predominantly
on heat conduction all the way through the
different layers of the substrates from a hot
point (the base of the component) to a cold
point (the furthest surface of the metal base)
and, usually, thereafter, through a dissipator.
Just as I tend to exhibit discomfort in oversized con-
ference halls and meeting rooms, I self-diagnose as
agoraphobic when it comes to entering PCB layouts
full of wasted space. Mechanical constraints which
utilize the printed circuit board substrate material as a
mechanical or structural "filler"
within an electronic product,
under-utilizing the material for
its intended purpose to support
conductive circuitry, grate on
me like nails on a chalkboard.
For the second consecutive year,
IPC is hosting an IPC Design Com-
petition, inviting printed circuit
board designers to compete to
become the
IPC Design
Champion of
2023.
One of the most amaz-
ing advances in PCB
manufacturing tech-
nology has been the
advent and usage of
laser direct imaging (LDI) technology. Though
the LDI revolution began more than 20 years
ago, there's still room for more PCB manufac-
turers to invest in this powerful tool.
For the latest news and information, visit PCBDesign007.com
Ventec Thermal Management
Book Excerpt: Chapter 1
Sensible Design: Comparing
Traditional and Bio-based Resins
A New Sourcing Paradigm Connect the Dots:
Examining the Benefits of
Laser Direct Imaging
Target Condition: Practical
Packaging Density in PCB Design
PCB Designers to Vie for
Design Champion Title at
IPC APEX EXPO 2023
