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26 PCB007 MAGAZINE I OCTOBER 2022 4. Karl Dietz, Tech Talk #198, Digital Imaging, Part A, The PCB Magazine, pp. 60–63, October 2012. 5. "Fine-resolution lithography enables next-gen- eration panel-level packaging," by John Large-field Chang, Proceedings of IMAPS Advanced SiP Con- ference-2022, Hilton Sonoma, California. Happy Holden has worked in printed circuit technology since 1970 with Hewlett-Packard, NanYa Westwood, Merix, Foxconn, and Gentex. He is currently a contributing tech- nical editor with I-Connect007, and the author of Automation and Advanced Procedures in PCB Fabrication, and 24 Essential Skills for Engineers. To contact Holden or read past columns, click here. 3.5 μm, and 4 μm isolated and dense line/space arrays. A higher resolution cross-sectional image of 3 μm lines (Figure 5c) shows dimensions for the middle line: 3.181 μm line width and 9.873 μm line height (resist thickness). 5 PCB007 References 1. Israel, Germany, Japan, Korea, China, U.S., Swit- zerland, Canada, Taiwan, UK, and Norway. 2. Karl Dietz Tech Talks of November 1997, May 1999, September 1999, August 2002, June 2004, April 2005, April 2007, July 2011, October 2011, November 2012, and November 2015. 3. "Laser Technologies for HDI Applications— new structuring and via processing", D.J. Meier and J. Kickelhain, Proceedings, Electronic Circuits World Convention (9), Oct. 7-9, 2002, Cologne, Germany. Figure 5: a) Bossung plot generated from FEM data showing less than 10% deviation over 60 μm DOF; b) lower resolution image of 3 μm, 3.5 μm, and 4 μm isolated and dense area line/space arrays; c) cross-section image of 3 μm lines in 10 μm thick dry film resist on copper substrate; the line critical dimension is 3.181 μm, and the resist height is 9.873 μm in the cross-sectional image. (Source: IMAPS SiP Conference—2022 Proceedings 5 )