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10 PCB007 MAGAZINE I OCTOBER 2022 We recently spoke with Loren Davidson, a senior manufacturing engineer at TTM Tech- nologies in Chippewa Falls, Wisconsin. In this wide-ranging discussion, Loren details the medium-volume facility's imaging processes and equipment, a variety of imaging tricks of the trade, and why it's so important to make decisions based on solid statistical data. Andy Shaughnessy: Loren, would you start by telling us how you got into imaging? Loren Davidson: I've been in the industry for 38 years. I started in the drill area, then three years later moved to imaging for inner layers. I spent the majority of my time there and have had some interaction with external or outer layer imaging over the years. About five years A Sharper Image ago I moved to cover both inner and outer layer imaging. ey're pretty complementary other than accounting for the differences in things like plating vs. print and etch. At TTM Chippewa Falls, we specialize in higher-end product with some volume, but not the high-end volume. We're pushing the envelope on technology to bring it to market quicker, and we're not building necessarily a prototype product, but product that's more mainstream. If it gets to the point where it's a commodity type product or something any- one else can build, then it gets moved to other facilities or even sent to China. at's the niche market we're trying to maintain. Shaughnessy: Great. Tell us about the process and the equipment. Feature Interview by the I-Connect007 Editorial Team

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