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info @ atotech.com www.atotech.com When reliability matters Pallabond ® – Direct pure EPAG for high-end circuitry and reliability applica on Increasingly fine features in printed circuit board and package substrate technology require a high resolution capable final finish that is universally applicable, more environmental friendly and highly reliable to sustain the hardest conditions, even in outer space. With Pallabond ® , we have developed an innovative new pro- cess that not only fully complies to new environment regulations, being a nickel and phosphor-free final finish, but furthermore is bio-compatible, highly reliable, and can be used for high-frequency and fine line plating applications in automotive, medical and aerospace mission critical components. Our new auto- catalytic pure palladium finish consists of very versatile Pd and Au electrolytes and is available for combined processing (ENEPIG and EPAG plating) in one plating line. With Pallabond ® , the gap loss from the depos- ited layer is minimized while the impact on signal loss is reduced to a minimum due to the utilization of highly conductive deposits. Compared to competitive final finishes, Pallabond ® assures lower operating temperatures, while providing high solder joint reliability. Other applications include; wire bonding of Au, Cu-Pd, Cu and Ag. To find out more about Pallabond ® , scan the QR-code to the right.