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62 SMT007 MAGAZINE I NOVEMBER 2022 Introduction IPC took a visionary step in October by hosting a two-day Advanced Packaging Sym- posium. Held at the Kimpton Hotel Monaco in Washington, D.C., the event brought together industry experts, government representatives, advocacy groups, and manufacturers to dis- cuss the strategic need for packaging capabil- ity, both advanced and traditional, outside the Asian region. Opening day speakers included keynotes from TechSearch's Jan Vardaman, and Intel's Tom Rucker. Additional speakers throughout the day represented DoD, NIST, the Euro- pean Union, Western Digital, IBM, AMD, Northrup Grumman, and BAE Systems. e second day's agenda included: SRC, Sky- Water, Amkor, Integra, Samsung, AT&S, AGC Tactonic, OKUNO, and Lam Research. A lively mid-morning panel was comprised Advanced Packaging Symposium 2022 Special Coverage by Nolan Johnson Photography © John Harrington

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