Issue link: https://iconnect007.uberflip.com/i/1483624
18 DESIGN007 MAGAZINE I NOVEMBER 2022 puting using DNA as computational elements. He designs strands of DNA that do computa- tion and circuits. It's genetic circuits; he makes chemical reactions go through oscillations and feedback loops. He says it's not designed to replace digital logic. It won't be fast, but it can control biological systems. Maybe I would get into genetic circuits. ere are many direc- tions to head and I'm not sure which will be the horse that wins. Shaughnessy: Eric, where is the cutting edge of technology now or in the next few years? Bogatin: ere are the high-end technologies, the high-speed serial links. e question always arises: When do we make the transition from electrons to photons? When will copper die? We did an issue on that in SI Journal last year. ere are systems demonstrated at DesignCon at 224 gigabits per second with copper. You're pushing the limits, and 224 gigabits per second per lane is pretty incredible in copper. Will you do 512? Maybe that's where optical will be. inking about optical interconnects is some- thing in the future. A big challenge is power consumption. If I was looking for a direction, I would look at power consumption, thermal management, and how you engineer for lower power con- sumption circuits. at's becoming a limit- ing feature. ere are a lot of these network processor chips. Google, NVIDIA, Facebook, even Uber have them. ey have huge server farms, and they do some of their own chips. Some of these network processor chips take 500 amps of current. Even if it's not high speed, per se, there are still challenges in doing the power routing. ere are many important design challenges for high-current distribution. IoT is this huge thing, and in these designs, energy harvesting is important. Many of these are portable. You need energy storage, energy harvesting, and the low-power communications to some gate- way or to the cloud directly. ere's a lot of life in the low end that requires good, thorough engineering. We spend so much time talking about just signal integrity and the highest high- speed serial links, but gosh, there are a lot of tough engineering challenges throughout the entire spectrum of electronic products today. Shaughnessy: is has been great, Eric. anks for doing this. Matties: Yes, Eric, it's always a pleasure. Bogatin: Thank you all for the oppor tunity. DESIGN007