PCB007 Magazine


Issue link: https://iconnect007.uberflip.com/i/1484263

Contents of this Issue


Page 38 of 115

info @ atotech.com www.atotech.com vPlate ® – New vertical systems solution for advanced HDI PCBs and IC substrates The increasing demand for finer lines and spaces within pattern plating technologies means that it is im- portant to greatly reduce the touching of the panel surface in order to avoid damages to the dry film. Our vPlate ® equipment is specifically designed for the touchless transportation of PCB panels for advanced manufacturing technologies such as SAP and (a)mSAP. It can be applied to various PCB types, ranging from standard multi layer and HDI to advanced HDI, rigid-flex, and IC substrates, with fine lines and spaces down to 8/8 µm. The vertical continuous copper plating equipment is fully automated and compatible with our InPro ® chemical process series for TH and BMV filling for advanced HDI, mSAP, and IC substrates, as well as our conformal plating processes such as InPro® VLF and InPro ® Flex 2. With vPlate ® , Atotech provides a one-stop-shop solution for effective equipment, software and process soltuions. To find out more about vPlate ® , scan the QR-Code to the right.

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Nov2022