Issue link: https://iconnect007.uberflip.com/i/1487920
68 DESIGN007 MAGAZINE I DECEMBER 2022 line. Without the benefit of the rigid backing material and a dedicated, product-defined car- rier pallet fixture, precise solder paste depo- sition and accurate component placement would not be possible. Fabrication companies have developed a broad range of solutions for panel layout to both encourage efficient handling and support large and small form factor circuits through the assembly process: • Single unit format (medium and large circuits) • Multiple unit array format (row and column layout) • Nested array format (maximizing area utilization) When processing the smaller form factor flexible circuits, the multiple unit array format has proved both efficient and economical. Palletizing the Flexible Circuit e carrier panel developed for flexible cir- cuit applications is designed to provide the uniform, rigid-board outline needed for con- veyor transfer and to physically support the flexible circuit through each assembly process sequence. To keep the single- and multiple- unit flexible circuits in place, the designer will need to provide small tab-like connecting fea- tures. To provide an area for the adhesion of the flexible material to the carrier panel, the flexible base material is simply extended out- ward to match the carrier panel outline. e adhesive film joining the flexible material to the rigid carrier panel must remain clear of the flexible circuit outline. e palletized, multi-unit example shown in Figure 3 represents a grouping designed to maximize material utilization for small, irregularly shaped flexible circuit units. is example represents flexible circuit units that are arranged in the opposing orientation or "nested" array format. Key Features Required for Automated Assembly e supporting panel must include several key attributes: 1. Edge clearance of the carrier panel must allow for unobstructed access to the conveyor support belt. 2. Two or more tooling holes are required, located outside the flexible circuit units to secure the panel during the post assembly separation procedure. 3. An equal number of "global fiducial Figure 3. Opposing orientation array format.