Issue link: https://iconnect007.uberflip.com/i/1488725
58 PCB007 MAGAZINE I DECEMBER 2022 Feature Article by Julia Gumminger IPC INTERNATIONAL e IPC APEX EXPO 2023 Technical Con- ference at the San Diego Convention Center will feature two hot topics—Advanced Pack- aging and e-Mobility/EV Automotive—in cus- tom and curated Special Sessions on ursday, Jan. 26. Please plan your travel accordingly to attend these exciting sessions. Advanced Packaging Led by IPC's Chief Technologist, Matt Kelly, the Advanced Packaging special session will provide latest insights on IC substrate and packaging needs from industry experts. e electronics industry is in the early stages of a new era, with unprecedented change already in motion. In this era of heterogeneous integration led by massive changes in semicon- ductor and advanced packaging sectors, the days of following Moore's Law are over. ese fundamental changes in the semiconductor sec- tor have significant impact throughout the rest of the electronics supply chain. As lines blur between IC substrate and HDI printed circuit board technologies and capabilities, the lines between OSAT and EMS manufacturers also blur. Please join us for this important Advanced Packaging Special Session focused on IC sub- strates and packaging assembly. Special Session Sneak Peek e session will be interactive with panelists providing top of mind priorities, followed by a panel discussion with interaction from attend- ees. HDI and ultra HDI PCB needs along with IC substrate and package assembly design, material, equipment, and process needs will be discussed. E-Mobility/EV Automotive Climate change, government policy, and con- sumers are all driving us fast and furious toward an electrified future. As our century-old, mostly mechanical modes of powering transportation transition to using electric powertrains, and with the ever-increasing use of electronic sys- tems in advanced driving assistance and auton- omy systems, the PCBA industry plays an increasingly important role in making sure that electronic assemblies can work harder, longer, and at higher operating temperatures. is pro- vides opportunities for many consumer PCBA manufacturers to participate in the automotive industry for the first time, but also creates chal- lenges for the industry around navigating new technologies and supply chains. Whether building an infotainment or driving assistance system with processors running over 200 watts, or a charging station's printed cir- cuit boards running at 1,000 volts, the industry is being called upon to help with design, mate- rial selection, and test in an environment where