PCB007 Magazine

PCB007-Dec2022

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92 PCB007 MAGAZINE I DECEMBER 2022 suppliers have attempted to address this prob- lem by using a combination of new formula- tions of binders in the ink and nanoparticle sil- ver; so far, results are promising. Table 3 shows materials and inks used in printed electronics. Conclusions Flexible materials are a key characteristic of printed electronics. Many products tradi- tionally utilize glass to protect the active lay- ers. To replace glass, the flexible substrates need to be an effective barrier against oxygen and water vapor, be sufficiently strong not to rip or tear and, if a cover, transparent to visi- ble light. Many plastics, such as Mylar®, poly- imide, PET, and ORMOCER® have these char- acteristics. Substrates can even be papers and paper hybrids. Table 4 shows the suitability of various base materials to printed electronics applications. Important to the growing ranks of suitable substrate materials is "photonic soldering," a new technology pioneered by NovaCen- trix in their PulseForge® product line, which allows standard lead-free solder pastes to be soldered without heating the flexible base materials; this unique ability enables metallic inks to be sintered/cured without damaging the substrates 2 . PCB007 References 1. "Flexible, Printed and Organic Electronics 2020–2030: Forecasts, Technologies, Markets," IDTechEx.com. 2. "Chapter 11: Printed Electronics," by Joe Fjels- tad, Flexible Circuit Technology, 4th Edition. 3. "Photonic Soldering," by Happy Holden, PCB007 Magazine, Dec. 20, 2021. Resources See "A Review of the Opportunities and Pro- cesses for Printed Electronics (Part 1)," by Happy Holden, a white paper originally published for SMTA International. Happy Holden has worked in printed circuit technol- ogy since 1970 with Hewlett- Packard, NanYa Westwood, Merix, Foxconn, and Gen- tex. He is currently a con- tributing technical editor with I-Connect007, and the author of Automation and Advanced Procedures in PCB Fabrication, and 24 Essential Skills for Engi- neers. To read past columns, click here. Table 3: Suitability and characteristics of various PE inks 2 Table 4: Current suitability of base material substrates for printed electronics applications 1

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