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40 What IPC is doing to further the conversation IPC has been actively working to educate policy- makers on the importance of investing in the entire semiconductor supply chain, including advanced packaging and printed circuit boards, to achieve the goals of the CHIPS Act. An IPC report last win- ter found the U.S. has only just begun to invest in advanced packaging, while nations in Asia have the lion's share of capabilities and capacity. A more recent report by IPC, based on a survey of nearly 100 industry leaders in semiconductors and related fields, shows strong industry support for increased public and private investments in advanced pack- aging efforts. The recently enacted CHIPS and Science Act includes IPC-backed provisions to invest at least $2.5 billion in advanced packaging capabilities in the U.S. in 2023. An IPC-convened symposium on the topic in Washington, D.C., was well attended by representatives of the U.S. government and all sectors of the electronics industry. We succeeded in nominating several packaging experts to a new USG advisory panel on microelectronics. IPC has also submitted official comments on the issue to the U.S. Department of Commerce and to the Euro- pean Commission, both of which are planning major investments in the semiconductor supply chain in 2023. How IPC members can get involved No matter who you supported in the last election, it's more important than ever to make sure they hear you as the new Congress gets down to business. IPC needs its members and friends to make their voices heard, and the best place to start is pledging to stay informed and engaged in IPC advocacy in 2023-24. When you sign up, IPC will keep you informed about the issues and send you timely opportunities to contact your elected officials on key issues. Scan the QR code; it only takes a few clicks and will add so much to the industry's advocacy effort.

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