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Broad Product Offering
• Engineering concept and design
• Design to Specification, assembly & cost
• Prototype / Pilot
• Ramp to Volume
• Volume Production
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Want to know how we're a leading global
manufacturer of technology solutions and PCBs..
• High-Density Interconnect ("HDI") and
Advanced HDI
• Substrate-like PCBs (SLP) including
CoreEZ & HyperBGA
® ®
• Flex, Rigid-Flex & Flex Assemblies
• High Layer Count / Large Format PCBs
• Microelectronics Custom Design &
Radiation Hardened Applications
• Custom Backplane Assemblies
• Specialty RF Products / Radar and
Communications Applications
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