Issue link: https://iconnect007.uberflip.com/i/1489269
20 SMT007 MAGAZINE I JANUARY 2023 Kelly: From a receiving standpoint, an EMS provider will need to increase their incoming quality inspection procedures because these are brand new parts. How are they receiving them and what is the quality? ese are the primary needs—improved logistics and ware- housing on the front end. In terms of assembly, there are some things to consider. First, there is the printing of very small, uniform deposits of solder paste, so you're not having opens or other defects. e printing of these can or will change whether they're big or small parts. In terms of reflow, you need an understanding of what these parts can handle. Hopefully, MSL values and other things are not changing these parts so that we don't go back to popcorning problems and inner layer, first level delamination issues of the parts. at will likely be covered as part of the component qualification process before the part comes in; next generation incoming inspection techniques continue to evolve. Can AOI and AXI tools inspect for defects of these parts when the IO count is high? With these packages, you'll see more silicon—more chiplets. When you look at X-ray, you're look- ing through the part. When you're in that cen- ter of the die, you can't really see what's under- neath because the die is dominating. When your whole package is covered with die, you can't necessarily see the bottom balls. Head-in- pillow (HIP) detection comes to mind because HIP will be a bigger problem here as warpage fights us. As more chips are placed in increasingly smaller areas, increased power densities are driving new thermal solutions to manage heat dissipation. Advanced heat sink structures, forced air, and active liquid cooling techniques will need to be developed for the most chal- lenging advanced packages. Increased usage of thermal interface materials (TIMs) is also expected. Test is the last area, and it's something oen overlooked because it's one of the last areas in the process. We will be doing test in different ways. e historical ICT/FCT flow may not work anymore because with miniaturization and limited real estate, you don't have much room for pin-outs for flying probe test or in- circuit test beds—bed of nails—where you want them to be. You must look at different test approaches moving forward. ere will be higher demand on boundary scan, more so- ware-based types of tests, and the like. ere's also the metrology needs for quali- fication or failure analysis within the lab. For example, being able to examine second-level interconnects with computed tomography (CT) X-ray in a timely manner will be quite a challenge from an I/O standpoint. You can imagine looking for subtile voiding defects in a 10,000 I/O component; it's like looking for a needle in a haystack. Why It's So Important Johnson: Why is advanced packaging so impor- tant to IPC right now? Kelly: IPC is expanding its mission. For the past 50 to 60 years, we have focused on being a printed circuit board and assembly focused organization. IC substrate and HDI PCB tech- nology lines are blurring. With IPC's extensive background in printed circuit boards, it's a nat- ural extension to support the changes that are underway across the industry. Likewise, while there are differences, there are also many sim- ilarities between EMS second-level assem- You can imagine looking for subtile voiding defects in a 10,000 I/O component; it's like looking for a needle in a haystack.