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4 SMT007 MAGAZINE I JANUARY 2023 FEATURE INTERVIEW The Nuts and Bolts of Advanced Packaging with Matt Kelly FEATURE ARTICLES Advanced Packaging Beyond the Zetabyte Era by Tom Rucker Key Findings From Semiconductor Fabrication Research by IPC Integra Redefining Die Prep in the U.S. by Matt Bergeron Durability and Cost Benefits Drive Mil-Aero Demand for OCPP by Sam Sadri FEATURE COLUMN Advanced Packaging by Nolan Johnson JANUARY 2023 • FEATURED CONTENT As semiconductor companies seek ways to prolong Moore's Law, new advanced component pack- aging techniques are moving the boundaries between printed circuit fabrication and semiconduc- tor fabrication. What will be the impact on the EMS industry? In this issue, we discuss how advanced packaging will change the structure of our industry. The Impact of Advanced Packaging 16 26 40 58 68 8 16 40 58 68

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