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JANUARY 2023 I SMT007 MAGAZINE 9 simply shines another spotlight on advanced packaging and confirms our reasoning for a focus here. Now, during my conversation with Chuck Bauer, he outlined all the different packag- ing technologies either entering the market, or currently under R&D development. It's not an either/or choice; in other words, mul- tiple packaging choices are coming our way. is topic fits under the heterogenous inte- gration banner, of course—the technology for extending Moore's Law by allowing an IC sys- tem to be broken into multiple chips which are then combined to configure the final prod- uct. Hopefully we'll be able to coax Chuck into sharing more on upcoming packaging technol- ogies in future issues. It's one thing to design the packages; it's another thing altogether to do the packaging at production volumes. As is true for much of our leading-edge technology, the United States leads the way in development, but then out- sources the humdrum manufacturing overseas. e goal of the CHIPS Act is to begin turning the tide. In February, NIST will begin accept- ing proposals for CHIPS Act programs. NIST has stated in presentations that it will be look- ing for and approving proposals that help bring additional capabilities to printed circuit boards and packaging alongside semiconductor build- out. Are you writing a proposal? is is such a big topic that we've dedi- cated all three I-Connect007 January issues to advanced packaging. Just like the advent of surface mount, advanced packaging brings changes to both PCB fabrication and PCB assembly. Even still, we'll only be cracking the book open on this topic; there will be much more to cover over time. For this issue of SMT007 Magazine, we con- tacted industry experts on packaging tech- nologies to get their perspective on advanced packaging, and followed up with many of the participants in the IPC symposium, seeking a deeper dive into their presentations. We found enthusiastic voices willing to share their con- cerns, solutions, and R&D work with you. To this end, we open with an interview with IPC Chief Technologist Matt Kelly, who helps define advanced packaging. Getting a bit more specific, Intel's Tom Rucker describes how advanced packaging will allow for more con- figuration inside the package, Sam Sadri from QP Technologies shares how OCPP tech- niques allow new IC systems to be used in ret- rofit situations, and Tom Bergeron of Integra shares insight on how die prep will change with advances in packaging. Equally important, MX2's Divyash Patel returns this month with more perspective on the upcoming CMMC milestone dates and why, if you haven't started certification yet, you may find yourself in a bind mid-year. Finally, we're always grateful for our colum- nists including Jennie Hwang, Michael Ford, and Ron Lasky. Each provides such a unique perspective from their many years of profes- sional experience. Jennie, for example, has been writing for I-Connect007 for more than two decades, and provides insight into how she made a pivotal switch from chemistry to engineering and the impact it has had. As you'll see, Bauer's three-dollar word fits not only the advanced packaging subject mat- ter, but with all our content, it's multi-direc- tional stemming from the same initial source. Happy New Year, and we hope to see you at IPC APEX EXPO 2023 in San Diego. References 1. "TSMC triples Arizona chip plant investment, Biden hails project," by Steve Holland and Jane Lan- hee Lee, Dec. 6, 2022, Reuters. 2. "Apple, NVIDIA to be first customers of TSMC Arizona chip plant," by Cheng Ting-Fang, Dec. 5, 2022, Nikkei Asia. SMT007 Nolan Johnson is managing editor of SMT007 Magazine. Nolan brings 30 years of career experience focused almost entirely on electronics design and manufacturing. To contact Johnson, click here.

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