Issue link: https://iconnect007.uberflip.com/i/1489269
22 SMT007 MAGAZINE I JANUARY 2023 bly and OSAT first-level component assembly. With IPC's long history in electronics assem- bly, it's a natural extension to support OSAT component-level assembly. Our members have been asking for increased engagement in advanced packaging and IPC is actively expanding support of advanced packaging in the areas of IC substrates and OSAT packaging assembly and test. CHIPS Act Funding Barry Matties: EMS providers will need to accommodate the changes and trends in the market. What should they be thinking about and what can we say that will help them learn along this journey? Happy Holden: How do you take an advanced surface mount assembly facility and make it an OSAT facility? How do you take an advanced printed circuit fab facility and make it an advanced substrate facility? Kelly: I believe the question is about whether an existing PCB fabricator can transform itself to produce substrates, and what an EMS pro- vider can do to transform itself into an OSAT assembler. Is that the question? Holden: One may evolve from the other, but they're not the same whatsoever. In North America, too many fabricators seem domi- nated by the perspective of, "Why should we change?" But if you look at the fabs embracing advanced packaging, they're likely facing two problems: Where do I get financing and how do I convince young engineers to work for me? is will take a lot of engineering horsepower because the IC fabs are out recruiting the same engineers. Kelly: One specific example for a PCB fab going to an IC substrate is environmental cleanliness. For yield, you need to be installing class 10,000 clean rooms. While there are similarities in equipment and tool sets, those quality control measures are paramount for quality and yield. Number one, then, is significantly increased process control. Holden: Almost to a level of passion. Kelly: Actually to levels that might make peo- ple faint. Qualification protocols will be much more stringent. Statistics will feed into both Factory of the Future and Industry 4.0 tech- niques. If we were to do some of this packaging in North America with qualification efficiency, you need the statistical knowhow—not just by the systems, but you need an understanding of what these numbers and dashboards mean. You need master black belts trained in design of experiments (DOX) and statistical methods. at is what fuels quality, but on the F2 side, data continues to be a theme because you need it to show whether you're in or out of spec, as well for automation for efficiency. I learned long ago from an IBM fellow that when you're dissecting these problems, you need to think about the what and the how. Fac- tory of the Future is the how, and advanced packaging is the what. If we can connect these two, that might be where we start to fully uti- lize Factory of the Future. Matties: Matt, do you have any final thoughts? Kelly: It's been said by many that this is a special point in time, a once-in-a-generation opportu- With IPC's extensive background in printed circuit boards, it's a natural extension to support the changes that are underway across the industry.