SMT007 Magazine

SMT007-Jan2023

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JANUARY 2023 I SMT007 MAGAZINE 89 Dr. Tom Rucker is vice president in tech- nology development at Intel and was a keynote speaker at the IPC Advanced Packaging Symposium, which helped set the table for the rest of the agenda. Tom understands this "radical and seismic" shift in terms of technology and breaks down what it means for the semi- conductor and PCB fab industries. There's absolutely a place at the table for PCB fabricators. In this month's column, Andy and Sue pre- pare to take two journeys— one to Mexico to tour a facil- ity that Maggie is interested in buying, and one of a more personal nature that will mean a more permanent union between them both. It's an exciting time in the lives of these two young professionals. In a market that is trying to catch up with increasing cus- tomer demands and quickly ship products out the back door, no electronics manufacturing plant can afford to lose any time or resources during the produc- tion process. Mitacs, a non-profit orga- nization committed to fostering innovation in Canada, and Hon Hai Research Institute, the research arm of Hon Hai Technology Group, signed a memorandum of understanding to advance quantum technology in Canada, with the active support of the Canadian Trade Office in Taipei. While solder balls can be produced during both SMT reflow and wave soldering, PCB hand soldering during touch up or rework can also result in solder ball formation. When moisture or other impurities entrapped in or on the surface of the PCB or component outgas during the hand soldering process, solder balls form. For the latest news and information, visit SMT007.com The 'Intel' on Advanced Packaging Options Knocking Down the Bone Pile: Eliminating Solder Balls in Hand Soldering Mitacs, Hon Hai Research Institute Announce New Canadian Quantum Research Project Material Management and Control Managing the supply chain for electronics manufactur- ing has always been chal- lenging. About 70–80% of the cost of building an elec- tronic product is for the parts, while the remain- ing cost is in the process to assemble and test the product. However, during the worldwide pandemic, the strain on the overall supply chain for any product has been stretched to the breaking point. Excerpt: The Evolving PCB NPI Process, Chapter 2 Maggie Benson's Journey: An 'Engaging' Conversation

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