Issue link: https://iconnect007.uberflip.com/i/1489778
32 DESIGN007 MAGAZINE I JANUARY 2023 We live in what can only be described as the golden age of electronics. Advancements and innovations grow by leaps and bounds, and never in history has the field of electron- ics grown at such a fantastic rate. Yet necessity is the mother of invention when discussing the PCB design industry and the advanced integra- tion packages field is one of the fastest-growing and most exciting. In 2020, the advanced packaging market was worth $24 billion and it's expected to grow as the estimated compound annual growth rate (CAGR) is 8% 1 —phenomenal growth resulting from consumer demand. It's an insatiable appe- tite for something bigger and better, not only with higher speeds in a smaller package, but to be inexpensive; this is what drives our industry and keeps us employed. is demand is on full display when Apple releases its latest and great- est, and folks are camped out for days waiting for the release. is trend shows no signs of slowing down. One solution to high demand? Advanced packaging. As legislation with the CHIPS Act focuses on domestic semiconductor fabrica- tion, the aim should be to increase the advanced package industry into the mainstream. Challenges with Advanced Interconnect Ever since Jack Kilby of Texas Instruments created the first hybrid IC made of germanium in 1958, and Robert Noyce created the first mono- lithic IC in 1959, the IC has generally remained the same—except for one significant difference in reducing the size of the transistors that make up every IC. When Kilby and Noyce created the first ICs, the size of the transistors was 11 nm. With today's smaller transistors, more nodes, as they are called, are now inside each IC. By 1965, Gordon Moore estimated that a computer's speed and capability could expect Advanced Packaging Not a Passing Fad Elementary, Mr. Watson Feature Column by John Watson, CID, ALTIUM