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JANUARY 2023 I DESIGN007 MAGAZINE 57 lithic system-on-chip. Semiconductor packag- ing emerged from a conventional mechanical protective structure to a packaging that adds value and differentiation from competitors. New logical partitioning methods, manufac- turing capabilities, and ecosystem dynamics are needed to target the latest advanced pack- aging technologies. e driving forces are het- erogeneous integration, disaggregated modu- larized SoC, and chiplet-based design. e through-silicon vias (TSVs), fanout wafer-level packaging (FOWLP), and system-in-package (SiP) approaches as alternatives to SoCs are driving more silicon content in packages. e transformation from monolithic silicon to multiple functional reusable chiplets (e.g., analog blocks, I/O blocks, memory, CPUs, and other IP) that can be integrated using advanced heterogeneous integration packaging technol- ogy provides a cost-effective alternative with a robust reuse model. is approach allows mix- ing into the design die from processes incom- patible with the basic logic process, such as DRAM or RF. e yield of a given silicon area built as a huge chip was much lower than the same silicon made from several separate dies and put together with 3D packaging. Advanced packaging has several such advan- tages but also presents challenges of planning, managing, and optimizing top-level design and connectivity. Moreover, the needs of IC and systems designers are converging, and the 3D ecosystem, design flow, and implementa- tion also pose several challenges. e world of 3D-IC packaging is still maturing, and the application of chiplets is ongoing. e stan- dards, a unified interface and toolchains are still evolving to support the design and imple- mentation of heterogeneous packaging. Tra- ditionally, process design kit (PDK)-based silicon design is standard in the industry. In contrast, package designs were executed with limited datasets available from the outsourced semiconductor assembly and test vendors (OSATs). Now, as silicon becomes a system-in-het- erogeneous integration, foundries are helping to drive the concept of PDKs in both silicon and the packaging world. A multi-chiplet 3D design flow is complex, and it is necessary to Figure 2: Automotive semiconductor market trends.