Issue link: https://iconnect007.uberflip.com/i/1490123
50 PCB007 MAGAZINE I JANUARY 2023 ere is even CFX messaging for hand solder- ing. To facilitate adapting machines and appli- cations, there are free soware development kits (SDK) available for Windows, .Net, Linux, LabVIEW, JAVA, etc. Already, hundreds of machines have been adapted and demon- strated with native CFX. Figure 6 is an over- view of the CFX SDK life cycle. e goal of the IPC committee is to facilitate a fully function- ing Industry 4.0 Digital Manufacturing World. Example (Figure 6) e IPC-CFX standard allows inspection data (2) and (3) from devices to be uploaded to MEM soware where compensation data (2) and correction data (2) are determined and downloaded to the screen printer and pick- and-place machines to improve quality and reduce downtime. SEMI-SECS/GEM e third standard protocol is SEMI's SECS/ GEM standard. is standard was established in the 1980s and '90s by the semiconductor industry (SEMI) and has been continuously updated. ere are over 900 English SEMI standards, with many more in Korean, Japa- nese, and Chinese. SEMI also has standards for other industries, including photovoltaic and liquid crystal display fabrication. e standards are open and non-proprietary. SEMI's docu- mentation is useful to establish messages and responses for PCB fabrication protocols. Like IC fabrication, the PCB fabrication process is thermodynamic, so the IC fabrication model is very useful for PCB fab and is different from the kinematic PCB assembly model. It has been updated with current wireless network- ing and security and is a convenient model for additional PCB automation. e PCB fabrica- tion standards are under development by the Taiwan Printed Circuit Association (TPCA); its model is shown in Figure 7. SEMI has PCB fabrication and assem- bly advisory boards working to connect the entire electronics supply chain into one digi- tal thread. Because of accessibility, originality, and security, SEMI is looking at "distributed ledger technologies" (blockchain) as a possi- ble technology to include in its General Equip- ment Model (GEM-E30) protocol. Find the SEMI standards on its website 6 . Conclusion e automation planning methodology is detailed in Automation and Advanced Proce- dures in PCB Fabrication 1 . By breaking down all work into time spent by a worker and by the machines for mechanization and systemization at various levels and classes, a plan can easily be prepared for new performance stages. e Figure 6: CFX enables assembly machines to talk to each other and pass important data up to management software for higher quality and productivity 4 .