Issue link: https://iconnect007.uberflip.com/i/1491409
30 SMT007 MAGAZINE I FEBRUARY 2023 also set up to do microvias. A lot of it is set up for copper fill. We have the advantage of doing both technologies. We can do it, whether it's backplanes with many layers or stacked and staggered micro- vias that might be only an eight-layer. We might be starting with a three- or four-layer in the center and then stacking off that. e line has full capability to do different processes. We've gone to the state-of-the-art chemis- tries in the line with insoluble anodes and side inductors on copper fill—everything it takes to do the state-of-the-art printed circuit boards in the future. Johnson: You started working with your plating supplier and there's 18 months' worth of back and forth designing your solution? Patel: No, the 18 months was strictly the man- ufacturing time; the designing was at least four additional months, as well as six weeks to install the line. Johnson: While you're waiting for your wet processes to be built out and delivered, what were you working on? Patel: e shutdowns due to the pandemic played a big factor. e plating line was six to eight months late. All our other wet process equipment was in the range of three to four months late. At that point, we didn't have a choice because you can't start a line with some key pieces missing. But in the next two to three weeks, we will be operating at 70%, and will be starting the testing phase. Smith: is is also a facility that will reuse its own water, so it will be environmentally friendly. We will generate probably one-tenth of the wastewater of a normal circuit board shop. We are planning for the future. Johnson: Who served as your lead project man- ager? Patel: I did. My background is in healthcare; I only have about two and a half years in this manufacturing business. But I have managed multiple businesses, started them from scratch, run them successfully, and then sold them off. My strength is management and vision. Johnson: And you're surrounded by a team that understands the technology very well. From a technical expert point of view, what were the surprises in setting up a facility like this? Smith: Since I've set up facilities and worked in engineering manufacturing for so long, I tend to understand this. But one of the things that surprised me a little bit was the type of equip- ment that we've brought in. We've brought in the best equipment that really can sustain us into the future and allow us to keep up with technology. e costs that it takes to do this were never an issue. We looked at what it actu- ally takes to perform well into the future and to have a sustainable business for North America. Custom Integrated Process Systems plating line with insoluble anodes for copper via fill technology.