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• Design007 Magazine — February 2023
• Feature Contents — Shrinking Silicon
• Additional Contents
• Column — Shrinking Silicon — A Warp Speed Facilitator
• Feature Interview — Shrinking Silicon, Growing Signal Integrity Challenges
• Short — Book Excerpt: The Printed Circuit Designer's Guide to…Designing for Reality
• Feature Interview — Shrinking Geometries: Back to Fundamentals to Fight EMI
• Short — DesignCon 2023 Opens With Strong Attendance
• Feature Column — Displacement Current: The Key to Electromagnetic Energy Propagation
• Column — Medical Technology: How PCBs Help Save Lives
• Interview — Are You Offering Options in Your Bill of Materials?
• Column — Test Vehicles for PCB Electrical Material Characterization
• Feature Interview — Shrinking Silicon, EMI, and SI
• MilAero007 Highlights
• Article — DFM 101—Final Finishes: OSP
• Flex007 Highlights
• Column — A Once and Future Idea
• Top Ten Editor's Picks
• Career Opportunities section
• Educational Resources
• Advertiser Index and Masthead
• Problems Solved! Subscribe to Our Magazines