Design007 Magazine

Design007-Feb2023

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52 DESIGN007 MAGAZINE I FEBRUARY 2023 because of the use of mixed technology boards (SMT and through-hole). ENTEK CU-106A: is is the most prevalent ver- sion primarily due to the ability to survive multiple thermal assembly operations. PCBs that have multiple surface finishes can use the CU-106A(X) finish. Pros and Cons of OSP Pros • Inexpensive and typically used in fine pitch surface mount designs • Environmentally friendly • Provides a coplanar surface • Lead-free (Pb-free) • Mixed metal applications Cons • Press fit pin insertion • Handling sensitive • Limited shelf life • In-circuit test (ICT) difficulties • Exposed copper aer assembly • Multiple reflow cycles and solder paste removal are problematic Understanding the cost drivers in PCB fab- rication and early engagement between the designer and the fabricator are crucial ele- ments that lead to cost-effective design suc- cess. Following your fabricator's DFM guide- lines is the first place to start. DESIGN007 Anaya Vardya is president and CEO of American Standard Circuits; co-author of The Printed Circuit Designer's Guide to… Fundamentals of RF/ Microwave PCBs and Flex and Rigid-Flex Fundamentals; and author of Thermal Management: A Fabricator's Perspective. Visit I-007eBooks.com to download these and other educational titles. He also co-authored "Fundamentals of Printed Circuit Board Technologies" and provides a discussion of flex and rigid flex PCBs at RealTime with… American Standard Circuits.

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