Issue link: https://iconnect007.uberflip.com/i/1493443
68 PCB007 MAGAZINE I FEBRUARY 2023 I heard that the story of how you automated the SES line is an interesting one. Can you talk about that? iel: What makes that story so interesting is that we approached the traditional DES/SES processes differently than how they are nor- mally structured. Due to limited floor space and the faster etching speed of ammonia, we had always combined the inner and outer layer etching on a single line. We wanted to continue with that model by creating a fully automated DES/SES line. Since our goal for automation was to eliminate operator setup, we had to configure the line with flexibility to run inner layers in a different path on the same line as the outer layers. We did that by creating a circular equipment pattern with the ability to handle four different process paths. To etch product, the operator simply selects the job on the com- puter and prints a barcode. Using job infor- mation from pre-production, as well as data gathered from prior processes such as dry film type used, the computer will select the appro- priate recipes to control the etcher, tin strip- per, dry film stripper, and three separate robots as well as multiple diverters to properly route the product. e operator only applies the bar- code to the job, loads the panels, and presses start. Is the shop fully automated now? iel: While not fully automated, we have auto- mated several other key areas over the years. ese areas include drilling, pumice scrub, sol- der mask imaging, etch/strip/tin strip, inner layer chemical clean and lamination, outer layer lami- nation, copper plating, copper via filling, legend inkjet printing, electrical test, and scoring. A Wise etcher with Technosystems automation.