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88 DESIGN007 MAGAZINE I MARCH 2023 At IPC APEX EXPO in San Diego, five competitors squared off to determine who was the best of the best at PCB design. At the end of the four-hour round, each competitor delivered their project file to the judges who convened to review designs, with a winning PCB design going to Sathishkumar Vijayakumar, senior PCB design engineer at Tessolve Semiconductor Pvt Ltd. in Bengaluru, India. Stackup decisions are critical to every PCB and electronic product, but they don't always get the attention they deserve. With better stackup planning focusing on six key parameters, designers can select the best materials early in the design process and minimize the risk of under- and over-designing their PCB. Hexagon's Manufacturing Intelligence division and Altium have entered a stra- tegic partnership which will help the design and manufac- turing of electronics be more environmentally sustainable. The partnership combines Hexagon's expertise in utilizing data from design and engineering, manufacturing, and metrology with Altium's strengths in PCB design and electronics supply chain intelligence to help companies understand the impact of product development decisions on the sustain- ability of electronics and smart products. As IC features continue to shrink, the PCB designer's job gets more interest- ing—signal speeds and rise times are increasing, they're encountering EMI and signal integrity issues once only seen in the RF world. TOP TEN Six Money-saving Material Properties When Designing PCB Stackups Hexagon, Altium Partner to Improve the Sustainability of the Electronics Industry IPC Design Competition Champion Crowned at IPC APEX EXPO 2023 EDITOR'S PICKS Shrinking Silicon, EMI, and SI Sathishkumar Vijayakumar

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