88 DESIGN007 MAGAZINE I MARCH 2023
At IPC APEX EXPO in San Diego, five competitors squared off to
determine who was the best of the best at PCB design. At the end of
the four-hour round, each competitor delivered their project file to the
judges who convened to review designs, with a winning PCB design
going to Sathishkumar Vijayakumar, senior PCB design engineer at
Tessolve Semiconductor Pvt Ltd. in Bengaluru, India.
Stackup decisions are critical to every PCB and electronic product, but
they don't always get the attention they deserve. With better stackup
planning focusing on six key parameters, designers can select the best
materials early in the design process and minimize the risk of under-
and over-designing their PCB.
Hexagon's Manufacturing
Intelligence division and
Altium have entered a stra-
tegic partnership which will
help the design and manufac-
turing of electronics be more
environmentally sustainable. The partnership
combines Hexagon's expertise in utilizing data
from design and engineering, manufacturing,
and metrology with Altium's strengths in PCB
design and electronics supply chain intelligence
to help companies understand the impact of
product development decisions on the sustain-
ability of electronics and smart products.
As IC features continue to shrink, the
PCB designer's job gets more interest-
ing—signal speeds and rise times are
increasing, they're encountering EMI
and signal integrity issues once only
seen in the RF world.
TOP TEN
Six Money-saving Material Properties When Designing PCB Stackups
Hexagon, Altium Partner to
Improve the Sustainability of the
Electronics Industry
IPC Design Competition Champion
Crowned at IPC APEX EXPO 2023
EDITOR'S
PICKS
Shrinking Silicon, EMI, and SI
Sathishkumar Vijayakumar
