SMT007 Magazine


Issue link:

Contents of this Issue


Page 81 of 83

82 SMT007 MAGAZINE I APRIL 2023 Solder Defects by Christopher Nash and Dr. Ronald C. Lasky, Indium Corporation This book is specifically dedicated to educating the printed circuit board assembly sector and serves as a valuable resource for people seeking the most relevant information available. SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal, Koh Young America An in-depth insight into new and exciting true 3D inspection technology is provided in this book, along with a look into the future of leveraging big data management and autonomous manufacturing for a smarter factory. Smart Data: Using Data to Improve Manufacturing by Sagi Reuven and Zac Elliott, Siemens Digital Industries Software Manufacturers need to ensure their factory operations work properly, but analyzing data is simply not enough. Companies must take efficiency and waste-reduction efforts to the next phase using big data and advanced analytics to diagnose and correct process flaws. Process Validation by Graham K. Naisbitt, Gen3 This book explores how establishing acceptable electrochemical reliability can be achieved by using both CAF and SIR testing. This is a must-read for those in the industry who are concerned about ECM and want to adopt a better and more rigorous approach to ensuring electrochemical reliability. NEW WEBINAR! On Demand: Free 12-part Webinar Series Smarter Manufacturing Enabled with Inspection Data with expert Ivan Aduna A smart factory is created from many parts, and inspection systems will play a critical role for process optimization in the next industrial revolution. Accurate, reliable 3D measurement-based data is essential, and a key element for a true smart factory. In this 12-part webinar series, viewers will learn about secure data collection, AI-powered solutions to manage and analyze data, and how to leverage the IPC CFX-QPL to succeed in the transformation to Industry 4.0. The Evolving PCB NPI Process by Mark Laing and Jeremy Schitter, Siemens Digital Industries Software In this book, the authors look at how market changes in the past 15 years, plus the slowdown of production and delivery of materials and components in recent years, have affected the process for new product introduction (NPI) in the global marketplace. As a result, we feel that PCB production companies need to adapt and take a new direction to navigate and thrive in an uncertain and rapidly evolving future. The Printed Circuit Assembler's Guide to... The Electronic Industry's Guide to...

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT007-Apr2023