IPC International Community magazine an association member publication
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IPC COMMUNITY 68 SPRING 2023 functionality, process assessment, end-prod- uct reliability and repair issues associated with 3D semiconductor package assembly and processing. IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry IPC-7092A describes the design, materials, and assembly challenges associated with implementing embedded circuitry into a printed board. IPC-7092A covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through- hole component attachment. IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles IPC-8952 establishes specific requirements for the design of printed electronic applica- tions and their forms of component mounting and interconnecting structures on coated or treated textile substrates. Textile substrate, as pertains to IPC-8952 standard, could be a bare textile or an integrated e-textile (e.g., woven or knitted e-textile). Coated or treated textile substrates, as pertains to IPC-8952 standard, are textile substrates which have or will have a coating or treatment localized or across the full substrate. IPC-8971 Requirements for Electrical Testing of Printed Electronics E-Textiles IPC-8971 is intended to assist in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on printed electronics on e-textiles. Printed electronics on e-textiles is printed electronics on coated or treated textile substrates. Coat- ings and treatments may be applied for print- ability of the textile substrate and/or for per- formance of the textile substrate or finished printed electronics e-textile (e.g., hydrophobic, water retardance, flame retardance, surface energy). Coatings or treatments may be applied using printing, lamination, or other processes. IPC-J-STD-003D Solderability Tests for Printed Boards IPC J-STD - 003D describes solderability determinations that are made to verify that the printed board fabrication processes and sub- sequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. Solderability is determined by evaluation of a test specimen which has been processed as part of a panel of boards and subsequently removed for testing per the method selected. IPC J-STD-003D pro- vides solderability test methods to determine the acceptance of printed board surface con- ductors, attachment lands, and plated through- holes to wet easily with solder, and to with- stand the rigors of the printed board assembly processes. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit www.ipc.org/status.