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Page 10 of 81

A Division of APCT Stronger Together To Serve You | APCT Leading The Printed Circuit Board Industry • Rigid Through-Hole ~ Up to 40-Layers • HDI; Blind/Buried/Stacked Vias ~ Up to 8x Sequential Laminations • Flex & Rigid Flex ~ Up to 22 Layers • Oversized Boards ~ Up to 37" by 120" • Heavy Copper ~ Up to 20oz. • Cavity Board Capability • RF Design Expertise • Buried Resistor Capability • Heat Sink Bonding Capability • Micro Electronic Technology e Acquisition of ACI Means Checking More Boxes for Our Customers APCT: Delivering More Solutions

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