Issue link: https://iconnect007.uberflip.com/i/1498723
44 DESIGN007 MAGAZINE I MAY 2023 Medium-cost Adders (10–25%) Regarding drilled hole quantity, there is a cost adder for high-density design-driven hole count and process time. With smaller drilled hole size, the small drill diameter (<0.010") limits throughput and stack height. Embedded resistors with Ohmega/Gould technology will need additional core testing and finished board verification. Non-FR-4 materials, like PTFEs, can be 10 to 20 times the FR-4 cost, and material cost is generally 25–50% of the board cost. Edge plating will have additional processes required prior to plating. High-cost Adders (>25% board cost) Advanced technologies may become "sci- ence projects" with industry non-standard processing or materials, or "bleeding edge" technology (<0.003" L/S, 1:1 aspect ratio microvias, 0.4 mm BGA technology, etc.). Sequential lamination and complex via struc- tures, as well as metal core or external heat sink requirements also add cost. If layer count will be >30 layers, the yield impact can be significant. Combination/ hybrid material sets can be high-cost adders. Regarding material/panel utilization, test coupons and board size can greatly reduce panel utilization; array configurations reduce panel utilization with unusable real estate; and there may be limited availability of panel sizes. Selective plating means multiple surface finishes or multiple thicknesses, complex processing requirements (e.g., masking), and the yield risk of combining non-standard pro- cesses. ere are also cost adders for line width