PCB007 Magazine


Issue link: https://iconnect007.uberflip.com/i/1499197

Contents of this Issue


Page 41 of 107

42 PCB007 MAGAZINE I MAY 2023 Editor's note: Welcome to our newest colum- nist, Preeya Kuray, a materials scientist who will be writing about the impact of global affairs on PCB R&D in America, as well as the growing intersection between the PCB and chip packag- ing industries. Although I fell into the PCB world somewhat accidentally, I remember the exact moment I knew I wanted to become a materials scientist. At an undergraduate engineering informa- tion fair, I saw the breadth of research possible within the materials science discipline: super- conductors, synthesizing gold nanoparticles for cancer cell detection, and organic photo- voltaics. It was all endlessly fascinating, and my curiosity drove me to ask what was possible, and more importantly, what was next. I didn't know the answers, but I knew that I needed to be a part of it. Ten years later, aer completing my PhD in materials science engineering, I found my current industrial R&D role: designing next- generation buildup films for HDI and chip packaging applications at AGC Multi Mate- rial America. Now I can put my passion and experience in materials science into practice for the PCB world, working toward answer- ing questions like these: If the chemical struc- ture of Component X is changed, how will this impact the overall buildup film proper- ties? Will Additive Y bolster or completely dismantle my dielectric constant? Will incor- porating Chemical Z enhance copper peel strength while still maintaining low moisture absorption? My Journey From Atomic Lattices to Circuit Boards Material Insight by Preeya Kuray, AGC MULTI MATERIAL AMERICA

Articles in this issue

Archives of this issue

view archives of PCB007 Magazine - PCB007-May2023