info
@
atotech.com www.atotech.com
Building bridges to higher technologies
To find out more about X-Plating, scan the QR-code to the right.
X-Pla ng – Patented bridge pla ng technology for inclusion-free core filling
of through holes
As an innovation leader, we are introducing our patented bridge plating technology for inclusion-free core
filling of through holes not only for horizontal panel plating but now also for vertical pulse plating in pattern
mode. The new process is mass production compatible and offers high reproducibility. Our X-plating
approach allows us to increase the aspect ratio by up to 3:1 and is highly reliable. The process facilitates
the filling of mechanical and laser drilled-through holes and offers 50 × better thermal conductivity than
thermal conductive plugging paste. This new technology is in production for core material of 50 to 300 μm
and is ideal for reducing processing costs and time while increasing yield.
