JULY 2023 I PCB007 MAGAZINE 77
Averatek is pleased
to announce Scott
Meikle, Ph.D. as CEO.
Dr. Meikle has more
than 30 years of expe-
rience in the semicon-
ductor industry.
RAIG was introduced a few
years ago to meet the require-
ments of newer designs. Since
its inception, more gold fin-
ishes are finding RAIG to be a
viable alternative to standard
immersion gold.
In 2023, the size of
the global printed cir-
cuit boards (PCBs) mar-
ket is anticipated to be
US$ 63.5 billion. The
growth of the market is
being driven by the expanding application in
the various end-use industries.
Ventec International Group Co., Ltd.,
has announced plans to open a
new manufacturing facility in South-
east Asia by 2025-26 to extend its
manufacturing capabilities beyond
China and Taiwan and enhance
global supply chain resiliency.
Insulectro, the largest distributor of materials for use in the manufacture of PCBs and printed
electronics, has announced it will become the exclusive distributor for North America of Arlon
copperclad laminates beginning Sept. 4, 2023. Arlon is also the master distributor for Elite
Materials Company (EMC) based in Taiwan bringing both product lines to Insulectro.
Summit Interconnect today announced the appointment of Brian Kamradt
as chief financial officer. Kamradt brings over 20 years of finance, account-
ing, merger and acquisition, and IT experience to Summit's leadership
team. He will succeed Tom Caldwell, Summit's initial CFO, who will be
retiring after leading the company's expansion for the past four years.
For the latest news and information, visit PCB007.com
Reduction Assisted
Immersion Gold for
ENEPIG Surface Finish
Insulectro Announces New Partnership With Laminate Suppliers
Arlon Electronics Materials and EMC
Ventec to Strengthen Global Supply
Chain and Logistics with New Factory
in Southeast Asia
Summit Interconnect Welcomes Brian Kamradt
as New Chief Financial Officer
Averatek Names New CEO
PCB Market Poised to Grow
at a CAGR of 5.1% and Reach
$104.8 Billion by 2033
Brian Kamradt
Scott Meikle