SMT007 Magazine

SMT007-Aug2023

Issue link: https://iconnect007.uberflip.com/i/1504794

Contents of this Issue

Navigation

Page 26 of 81

N E X T B E C O M E S W H A T S IPC.ORGAPEXEXPOCFP | #IPCAPEXEXPO ecwc16 E L E C T R O N I C C I R C U I T S W O R L D C O N V E N T I O N JANUARY 22, 2024 Conference Paper Abstracts Due Conference Poster Abstracts Due Professional Development Course Abstracts Due SEPTEMBER 18, 2023 AUGUST 28, 2023 CALL FOR PARTICIPATION IPC invites engineers, researchers, academics, students, technical experts, and industry leaders to submit abstracts for the Electronic Circuits World Convention 16 (ECWC16) Technical Conference hosted by IPC APEX EXPO 2024. • Quality, Reliability, Test and Inspection • Design • PCB Fabrication and Materials • HDI, uHDI and Substrates • Electronic Assembly Materials • Assembly Processes • Factory of the Future Implementation • High Reliability for Extreme Requirements • Sustainability for Electronics • Emerging Technologies • Market Trends and Outlook TECHNICAL TRACKS

Articles in this issue

Links on this page

Archives of this issue

view archives of SMT007 Magazine - SMT007-Aug2023