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42 DESIGN007 MAGAZINE I AUGUST 2023 Feature Article by Yuriy Shlepnev SIMBERIAN Data rates in PCB interconnects are increas- ing in all signaling protocols (PCIe, DDR, GDDR, Ethernet, USB, SAS, InfiniBand, CEI, OIF, 5G). Most of those high-speed signaling standards have one-lane data rates over 6 Gbps (GT/s) and some up to 112 Gbps with signal spectrum in microwave and even millimeter wave bandwidths 1 . Design of compliant inter- connects at these data rates cannot simply rely on geometrical rules or rules of thumb. Signal distortion by reflections, dissipation and cross- talk can cause interconnect performance deg- radation or even failure. To avoid it, signal integrity compliance analysis and possible interconnect optimization is required. Our soware provides 3D electromagnetic analysis of PCB and packaging interconnects. It can be used for pre-layout design (stackup exploration, via hole design) and post-layout interconnect compliance analysis and optimi- zation. Simbeor ensures the accuracy of the models by using advanced algorithms for 3D full wave analysis, benchmarking, and experi- mental validation. Simbeor and the "sink or swim" interconnect design process 2,7 remove all uncertainties and guarantee the first pass design success. Most importantly, it lets you solve electromagnetic signal integrity prob- lems at a relatively low cost and with extreme ease. You don't need to be an expert in signal 3D Electromagnetic Analysis