86 SMT007 MAGAZINE I SEPTEMBER 2023
Professional Development Courses
Half-day (3.5 hours) educational courses are led
by internationally respected professionals with
extensive experience in the subject area.
Course instructors deliver focused, in-depth pre-
sentations on topics of current importance to the
industry, based on their research and industry expe-
rience. Professional Development Courses are
application oriented and structured to combine field
experience with scientific research to solve everyday
problems.
Monday, October 9
1:30 p.m.–5:00 p.m.
"Artificial Intelligence–Opportunities, Challenges,
and Possibilities"
Presenter: Jennie Hwang, Ph.D., H-Technologies
Group
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"Weeding out PCB Defects Prior to Assembly"
Presenter: Bihari Patel, BP SMT Connections Inc.
View full course outline
"Best Practices for Improving Manufacturing
Productivity"
Presenters: Phil Zarrow and Jim Hall,
ITM Consulting
View full course outline
"Reflow Profiling Simplified"
Presenter: Robert Rowland, Axiom Electronics LLC
View full course outline
Tuesday, October 10
1:30–5:00 p.m.
"Flex Circuit 'Design for Manufacturing
Principles' Circuit Design, Fabrication,
and SMT Assembly Processing"
Presenter: Vern Solberg, Solberg Technical
Consulting
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"Solder Joint Reliability—Principle and Practice"
Presenter: Jennie Hwang, Ph.D., H-Technologies
Group
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"How to Select a Solder Paste
for High Reliability and Yields"
Presenter: Ron Lasky, P.E.,
Indium Corporation
View full course outline
Wednesday, October 11
1:30–5:00 p.m.
"Selection Criteria of Surface Finishes for Better
Reliability of Electronic Assemblies"
Presenter: Kunal Shah, Ph.D., Lilotree
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"Fan-Out, Chiplet, and Heterogenous
Integration Packaging"
Presenter: John Lau, Ph.D., Unimicron
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"ESD Concept to Reduce
Electrostatic Charges
in Manufacturing Processes"
Presenter: Hartmut Berndt,
B.E. STAT ESD
Competence Centre
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"Failure Analysis of Electronic
Devices"
Presenter: Martine Simard-
Normandin, Ph.D.,
MuAnalysis Inc.
View full course outline