Issue link: https://iconnect007.uberflip.com/i/1506834
80 SMT007 MAGAZINE I SEPTEMBER 2023 the topic. is year, APT has papers on new package materials and processes, including hybrid bonding and heterogeneous integra- tion. ere also are several papers on board level and package reliability. e High Performance and Reliability (HPR) track has two sessions dedicated to hardware ruggedization for extreme environments. e research presented is applicable to manufac- turers in the automotive and power electronics sectors, among others. e Interconnect Research and Reliability (IRR) track has an interesting session on alloy development and considerations for high reli- ability. IRR also has a session discussing pro- grams for high reliability for mission critical applications. is session would be of inter- est to anyone wondering how the avionics and military/defense industries are addressing the need to convert to Pb-free manufacturing. e Low Temperature Solder (LTS) track continues to have multiple, strong sessions addressing all aspects of low temperature sol- dering with Sn-Bi alloys, such as thermal cycling performance, reliability assessment of new alloys, effects of elemental additions, electromigration, shear and drop shock assess- ment, and improving process yield, quality, and reliability. e Test and Inspection (INS) track has its strongest program in years with four diverse sessions addressing AI, machine learning, advanced imaging techniques, applications, and case studies. e Manufacturing Excellence (MFX) track addresses several interesting and tangible top- ics including manufacturing operations, prod- uct assembly challenges, printing challenges, cleaning challenges, new product introduction (NPI), and more. For more in-depth training, there are 11 half-day Professional Development Courses (PDCs) on electronics reliability and process- specific topics instructed by industry experts. Monday, Oct. 9 options: • Artificial Intelligence: Opportunities, Challenges and Possibilities • Weeding Out PCB Defects Prior to Assembly • Best Practices for Improving Manufacturing Productivity • Reflow Profiling Simplified Tuesday, Oct. 10 options: • Flex Circuit Design for Manufacturing Principles • Solder Joint Reliability: Principle and Practice • How to Select a Solder Paste for High Reliability and Yields Wednesday, Oct. 11 options: • Selection Criteria of Surface Finishes for Better Reliability of Electronic Assemblies • Fan-Out, Chiplet, and Heterogenous Integration Packaging • ESD Concept to Reduce Electrostatic Charges in Manufacturing Processes • Failure Analysis of Electronic Devices Selecting the conference bundle when you register will provide the best value to attend both the conference sessions and courses. New this year is a free session called Trans- lating the Technology. is session will pro- vide an overview of PCB design, fabrication, and assembly, with a panel discussion focused on the impact that strong communication throughout the full process can have on project success. Humorous faux pas, lessons learned, and success stories will be shared as this expert panel fields questions and imparts wisdom. Following the panel discussion, we will break into interest groups to chat with experts on topics ranging from PCB design, fab, and assembly, to PCB and PCBA purchasing best practices, and how robotics is revolutioniz-