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SEPTEMBER 2023 I DESIGN007 MAGAZINE 9 Andy Shaughnessy is managing editor of Design007 Magazine. He has been covering PCB design for 23 years. To read past columns, click here. flex also brings challenges for designers of traditional rigid boards. Stackup design is a whole different animal with rigid-flex, especially with multiple rigid boards. Sig- nal integrity analysis can be a real challenge here, and proper DFM practices are critical. Your data package is more important than ever. Are you conveying your design intent to your fabricator? Are you communicat- ing with your fabricator during the design cycle? is month, we asked our expert con- tributors to share their best tips, tricks, and techniques for designing rigid-flex cir- cuits. We start with a conversation with IPC instructor Kris Moyer, who explains the high points of his rigid-flex design class, while throwing in some DFA tips as well. Vern Solberg provides DFM techniques for flex and rigid-flex circuits. Bill Hargin details the finer points of designing stack- ups for rigid-flex. Mike Morando discusses what OEMs should consider when selecting a rigid-flex fabricator. Tim Haag examines the oen-overlooked correlation between human ingenuity and rigid-flex technology, and Cherie Litson offers a great set of rigid-flex design guide- lines. Joe Fjelstad explains how to "unlock" some of the perhaps unseen benefits related to rigid-flex circuits. We also have a column by Matt Stevenson, and articles by Anaya Vardya (who begins a new series on the fundamentals of UHDI), Brad Griffin, and Léa Maurel of ICAPE, talking about sourc- ing diversification. We're coming up on trade show season, and I-Connect007 will be covering PCB West and SMTA International in the next few months. Hope to see you there. DESIGN007 Professor Soon-Yong Kwon in the Department of Materials Science and Engineering and the Gradu- ate School of Semiconductor Materials and Devices Engineering at UNIST, in collaboration with Profes- sor Zonghoon Lee, has embarked on a pioneering research endeavor focusing on the development of high-performance p-type semiconductor devices, uti- lizing molybdenum ditelluride (MoTe2)—a compound renowned for its unique properties. This pioneering technology holds great promise for application in the next-generation complementary metal oxide semi- conductor (CMOS) industry, where ultrafine technol- ogy is crucial. In this research endeavor, spearheaded by Profes- sor Kwon's team together with Professor Lee's team, they focused on developing high-performance p-type semiconductor devices utilizing MoTe2—a compound known to exhibit unique properties. By employing chemical vapor deposition (CVD) techniques that facil- itate thin film formation through chemical reactions, the researchers have successfully synthesized large- area 4-inch MoTe2 wafers with remarkable purity. This study has been jointly carried out by Profes- sor Soon-Yong Kwon (co-corresponding author), Pro- fessor Zonghoon Lee (co-corresponding author), Dr. Seunguk Song (co-first author) from the University of Pennsylvania, Dr. Aram Yoon (co-first author), and Sora Jang (co-first author). The results have been pub- lished ahead of their official publication in the online version of Nature Communications on August 7, 2023. (Source: UNIST) Fabrication of P-Type 2D Transistor Arrays with Van Der Waals Semi-metal Electrodes

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