PCB007 Magazine

Advanced Packaging Capability Gap Source: DoD Presentation GLOBAL SEMICONDUCTOR SUPPLY CHAIN ADVANCED PACKAGING MARKET SIZE IC SUBSTRATE CAPABILITY COUNTS BY REGION USA JAPAN S.KOREA CHINA TAIWAN Source: IPC $44.6B $30.6B Semiconductor design 85% USA 75% Manufacturing ASIA 97% Packaging ASIA Wirebond WB-PBGA FC-PBGA FC-CSP BOC SiP Source: Mordor Intelligence

• PCB007 Magazine — September 2023
• Featured Content — Finding Ultra
• Additional Content
• Column — Convergence
• Feature Interview — The Drive Toward UHDI and Substrates
• Feature Article — What is Ultra HDI?
• Infographic — Advanced Packaging Capability Gap
• Feature Q&A — Cutting-edge Inspection Challenges
• Short — A Primer on UHDI
• Feature Interview — Pivoting on Substrates
• Column — The Pros and Cons of Tribal Knowledge
• MilAero007 Highlights
• Column — Why TDR?
• Article — Culture by Design: Building a Winning Team from the Start
• Column — Don't Just Blame the Etcher
• SEL Section — The SEL Supply Line
• SEL Section — GreenSource Engineering: An Eye on Design
• SEL Section — Notion Systems: The Arrival of the 'Jet Age'
• SEL Section — Sigma Mecer: Turning Copper 'Green'
• SEL Section — Schmoll: Pushing Drilling Forward
• SEL Section — Atotech: More Horizontal Panel Plating in the U.S.
• SEL Section — Chemcut: Blending Capabilities and Culture
• Column — Processes to Support IC Substrates and Advanced Packaging, Part 4
• Short — PCB Industry Advocating with U.S. Government Officials
• Column — Computer-aided Bare Board Testing, Revisited
• Top Ten Editor's Picks
• Career Opportunities
• Educational Resources
• Advertiser Index and Masthead
• Problems Solved! Subscribe to Our Magazines