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Advanced Packaging Capability Gap Source: DoD Presentation GLOBAL SEMICONDUCTOR SUPPLY CHAIN ADVANCED PACKAGING MARKET SIZE IC SUBSTRATE CAPABILITY COUNTS BY REGION USA JAPAN S.KOREA CHINA TAIWAN Source: IPC $44.6B $30.6B Semiconductor design 85% USA 75% Manufacturing ASIA 97% Packaging ASIA Wirebond WB-PBGA FC-PBGA FC-CSP BOC SiP Source: Mordor Intelligence

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